复合材料圆板Ⅳ型界面裂纹扩展应力位移场
Stress and Displacement Fields of the Mode Ⅲ Interface Crack Propagation in Bimaterial Disc
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摘要: 对Ⅲ型界面中心裂纹的均匀各向同性脆性复合材料薄圆板裂纹扩展进行了研究.通过建立数学模型和基本方程,找出了边界条件,并用分离变量法进行求解,得到了裂纹尖端附近应力场和位移场的解析解.采用所建立的模型,针对实际可能出现的裂纹扩展问题进行了讨论.Abstract: The stress and displacement fields is analyzed, by using the separation of variables, around the crack tip of the mode Ⅲ central crack propagation at the interface between two different medias in a thin disc with homogeneous and isotropic brittle materials. The analysis solution is obtained and discussed.
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