多核处理器核间互连的新型互连网络

A New On-Chip Interconnection Network for Multi-Core Processor

  • 摘要: 提出了一种用于片上核间互连的新型互连网络——基三分层互连网络.该网络具有明显的层次性和对称性以及良好的扩展性.与2-D Mesh相比,在网络规模不大时,基三分层互连网络更适用于构建片上核间的通信网络.仿真结果表明,该网络具有较低的平均通信延迟和较高的平均吞吐率.

     

    Abstract: A new interconnection network for multi-core processor,named the triplet-based hierarchical interconnection network(THIN),is presented.The topology of the network is very simple and it has obvious hierarchical,symmetric and scalable characteristics.The compare results show THIN is superior to 2-D mesh to construct interconnection network when there are not too many nodes.Results of simulation showed that THIN is a promising choice for multi-core processor with low network latency and high throughput.

     

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