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Gradual Band Evolution at the Electron-Correlated Interface in a Laterally Hetero-Epitaxial Two-Dimensional Heterostructure

  • Xiang Ren
  • , Shihao Hu
  • , Genyu Hu
  • , Wuyi Gao
  • , Yun Zhang
  • , Songdi Liu
  • , Yuxuan Luo
  • , Tianshu Zhang
  • , Tianyu Dai
  • , Yusen Wang
  • , Jianpeng Li
  • , Ziqiang Xu*
  • , Zhixin Hu*
  • , Yan Shao*
  • , Xu Wu*
  • *Corresponding author for this work
  • Beijing Institute of Technology
  • Guizhou Normal University
  • Tianjin University

Research output: Contribution to journal › Article › peer-review

Abstract

As a fundamental characteristic, interfacial band evolution exerts a profound impact on the performance of heterostructures, especially the two-dimensional (2D) lateral heterostructure, which is anticipated with its excellent interfacial properties. Despite intensive reports on semiconductors, studies on 2D electron-correlated heterostructures, which hold big expectations for quantum devices, remain in their early stages on limited materials, hindered by the lack of a controllable fabrication strategy. Here, we report the laterally epitaxial fabrication of the 1T-NbSe2/1T-VSe2 heterostructure and the visualization of the band evolution at its electron-correlated interface. With designed parameters, the 2D VSe2 was successfully grown adjacent to the presynthesized 1T-NbSe2. Atomic-resolution characterizations reveal a well-aligned atomic lattice at the interface. A continuous band profile, particularly the gentle interfacial evolution of the Mott-Hubbard bands, was visualized at the interface, showing the gradual band bending of the upper Hubbard band (∼0.026 eV) and a shrinkage of the Mott-Hubbard gap from 0.124 eV with a decay length of ∼2.4 nm. Our work offers an essential strategy for the fabrication and visualization of 2D electron-correlated heterostructures, laying the groundwork for their fundamental study and future applications.

Original languageEnglish
Pages (from-to)1313-1320
Number of pages8
JournalJournal of Physical Chemistry Letters
Volume17
Issue number5
DOIs
Publication statusPublished - 5 Feb 2026
Externally publishedYes

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