!!Research output per year
!!Research output per year
指纹图谱
深入探索 Ziyue Zhang 活跃其中的研究主题。这些主题标签来自该研究者的学术成果，它们共同构成了一个独特的学术指纹.
- 6 相似学者
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A Simulation Study of a Bandpass Filter Formed by CNT-Core Cu-TSVs with Enhanced Thermal Management
Wang, H., Ding, Y., Zhang, Z., Zhang, J., Zhang, A., Pei, X. & Chen, Z., 6月 2026, 在: Micromachines. 17, 6, 724.科研成果: 期刊稿件 › 文章 › 同行评审
开放访问 -
Double-Sided Fabrication of TSV Interposer With Parylene-Based Damascene RDLs Achieved by Selective Electroless Plating
Su, Y., Ding, Y., Zhang, Z., Wang, H., Hao, Y., Yan, Y., Xie, H. & Chen, Z., 2026, 在: IEEE Electron Device Letters. 47, 1, 页码 140-143 4 页码科研成果: 期刊稿件 › 文章 › 同行评审
2 在新选项卡中打开链接 引用 （Scopus） -
Fabrication and Characterizations of High-Aspect-Ratio TSVs With Low Parasitic Parameters for High-Density 3-D Integration
Chen, X., Chen, Z., Zhang, Z., Zhang, J., Su, Y. & Ding, Y., 2026, (已接受/待刊) 在: IEEE Transactions on Electron Devices.科研成果: 期刊稿件 › 文章 › 同行评审
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A contamination-free and low-leakage-current Cu-TSV technology enabled by engineered double-sided processing
Hao, Y., Ding, Y., Zhang, Z., Yang, B., Zhang, J., Xie, H. & Chen, Z., 12月 2025, 在: Microsystems and Nanoengineering. 11, 1, 199.科研成果: 期刊稿件 › 文章 › 同行评审
开放访问5 在新选项卡中打开链接 引用 （Scopus） -
A Microfluidic Cooling Strategy Enabled by Silicon-based Microchannels with Pin-Fins for Thermal Management of 2.5D Heterogeneous Integration
Su, Y., Ding, Y., Chang, H., Zhang, J., Yan, Y. & Zhang, Z., 2025, 2025 IEEE 20th Nanotechnology Materials and Devices Conference, NMDC 2025. Institute of Electrical and Electronics Engineers Inc., 页码 229-232 4 页码 (2025 IEEE 20th Nanotechnology Materials and Devices Conference, NMDC 2025).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审