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High-Resolution Multispectral Photovoltaic Imagers from Visible to Short-Wave Infrared

  • Wanqing Li
  • , Cheng Bi
  • , Min He
  • , Xiaolong Zheng
  • , Yuning Luo
  • , Yimei Tan
  • , Chenxi Liu
  • , Salihuojia Talanti
  • , Yanfei Liu
  • , Ge Mu
  • , Qun Hao
  • , Kangkang Weng*
  • , Xin Tang*
  • *此作品的通讯作者
  • Beijing Institute of Technology
  • Ltd.
  • Changchun University of Science and Technology
  • Minzu University of China

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

Visible to short-wave infrared multispectral imaging is gaining significant attention across various fields, including agriculture, security, and medical diagnostics. Traditional multispectral imaging systems often rely on separate sensors for different spectral bands, leading to complex optical alignment and irreversible resolution loss. Here, we present hardware-algorithm co-designed architecture to achieve multispectral super-resolution imaging. Specifically, we demonstrate a monolithic quad-spectral photovoltaic imaging platform featuring a resolution of 640 × 512 pixels with <1% dead pixels per channel. The system achieves broadband spectral integration from visible to short-wave infrared (350–2350 nm) by combining an all-polymer bulk heterojunction with colloidal quantum dots within a single CMOS-compatible architecture. The compatibility of all-polymer bulk heterojunction with direct photopatterning allows for precise patterning and high-density integration, enabling the devices to operate efficiently in photovoltage mode. To address resolution degradation inherent in planar-integrated spectral sensing architectures, we applied a super-resolution reconstruction method, restoring images to a resolution of 640 × 512. The demonstrated capability to simultaneously capture and process multispectral data paves the way for CMOS integration, multispectral Imagers, organic photodetector, super-resolution reconstruction applications in diverse fields, from precision agriculture to medical diagnostics and beyond.

源语言英语
期刊论文编号e19991
期刊Advanced Science
卷13
期18
DOI
出版状态已出版 - 27 3月 2026

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